SCH-PT is the exclusive distributor in Taiwan of SUMITOMO A.L.M.T. grinding wheels from Japan including special ceramic bond diamond grinding wheels for wafer/backside grinding.The “Nanomate Premium Series” of diamond wheels delivers the high-precision grinding performance demanded by the market. A grit layer with “high porosity” and “uniform structure” provides longer grinding life and lower loads at the same grinding speed. Edge chipping of wafers and machining costs are also reduced.

Si Fine Grinding Wheel:

Superfine diamond and high-quality ceramics have changed people’s perception of grinding wheels. Ultra-fine materials can be bonded together using cutting-edge materials and production techniques.

Benefits include reduced depth of damage layer and homogenization of strain layer during the processing of materials.

SiC Fine Grinding Wheel:

Nanomate Masspower represents the new generation of high-performance, low-load SiC fine grinding wheels.

An optimal combination of diamond grid and ceramic bonding agent improves endurance and grinding efficiency while delivering optimal surface